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FZT955-MS

FZT955-MS

  • 厂商:

    MSKSEMI(美森科)

  • 封装:

    SOT223-3

  • 描述:

    集射极击穿电压(Vceo):-140V 集电极电流(Ic):-4A 功率(Pd):3W 集电极截止电流(Icbo):50nA 集电极-发射极饱和电压(VCE(sat)@Ic,Ib):370mV@3A,...

  • 数据手册
  • 价格&库存
FZT955-MS 数据手册
www.msksemi.com FZT955-MS Semiconductor Compiance PNP Transistors SOT-223 Ƶ Features 1 1. BASE 2. COLLECTOR ƽ Collector Current Capability IC=-4A 2 ƽ Collector Emitter Voltage VCEO=-140V 3 3. EMITTER ƽ Very low saturation voltages Absolute Maximum Ratings Ta = 25ć Parameter Symbol Rating Collector - Base Voltage VCBO -180 Collector - Emitter Voltage VCEO -140 Emitter - Base Voltage VEBO -6 IC -4 Peak Pulse Current ICM -10 Collector Power Dissipation PC 3 W RșJA 78 ć/W Collector Current - Continuous Unit V A Thermal Resistance, Junction to Ambient (Note 1 ) Operating and Storage Temperature Range TJ,Tstg ć -55 to 150 Note 1:For a device mounted with the collector lead on 25mm x 25mm 1oz copper that is on a single-sided 1.6mm FR4 PCB; device is measured under still airconditions whilst operating in steady-state. Electrical Characteristics Ta = 25ć Parameter Symbol Test Conditions Min Collector- base breakdown voltage VCBO Ic= -100 ȝAˈ IE=0 -180 Collector- emitter breakdown voltage VCER IC=-1 ȝA, RB ” 1kȍ -180 Collector- emitter breakdown voltage VCEO Ic= -10 mAˈ IB=0 -140 Emitter - base breakdown voltage VEBO IE= -100ȝ Aˈ IC=0 -6 Collector-base cut-off current ICBO Collector cut-off current R < 1kȍ Emitter cut-off current Collector-emitter saturation voltage ICER IEBO VCE(sat) Base - emitter saturation voltage VBE(sat) Base - emitter turn-on voltage VBE(on) DC current gain Switching Times Collector output capacitance Transition frequency hFE Typ Max Unit V VCB= -150 V , IE=0 -50 nA VCB= -150 V , IE=0 , Ta = 100ć -1 ȝA VCE= -150 V , IE=0 -50 nA VCE= -150 V , IE=0 , Ta = 100ć -1 ȝA nA VEB= -6V , IC=0 -10 IC=-100 mA, IB=-5 mA -60 IC=-500 mA, IB=-50mA -120 IC=-1 A, IB=-100mA -150 IC=-3 A, IB=-300mA -370 IC=-3 A, IB=-300mA -1110 VCE= -5V, IC= -3A mV -950 VCE= -5V, IC= -10mA 100 VCE=- 5V, IC= -1 A 100 VCE= -5V, IC= -3 A 75 300 VCE= -5V, IC= -10 A 10 68 toff IC=-1A, IB1=-100mA IB2=100mA, VCC=-50V Cob VCB= -20V,f=1MHz 40 pF VCE= -10V, IC= -100mA,f=50MHz 110 MHz ton fT ns 1030 www.msksemi.com FZT955-MS Semiconductor Compiance Typical Characterisitics IC/IB=50 1.6 1.6 - (Volts) V& ( VDW  - (Volts) V& ( VDW  1.4 1.2 1.0 0.8 0.6 0.4 1.2 1.0 0.8 0.6 0.2 0 0.001 0.01 0.1 1 1.4 0 10 20 0.001 0.01 0.1 1 10 20 I&- &ROOHFWRU&XUUHQW $PSV  I&- &ROOHFWRU&XUUHQW $PSV  VCE(sat) v IC VCE(sat) v IC +100°C +25°C -55°C 1.6 VCE=5V -55°C +25°C +100°C +175°C 1.6 300 IC/IB=10 1.0 200 0.8 0.6  100 0.4 - (Volts) V% ( VDW  1.4 1.2 h)( - Typical Gain h)( - Normalised Gain 1.4 IC/IB=10 0.4 0.2 0.2 0 -55°C +25°C +175°C Tamb=25°C IC/IB=10 1.2 1.0 0.8 0.6 0.4 0.2 0.001 0.01 0.1 10 20 1 0 0.001 0.01 0.1 1 10 20 I&- &ROOHFWRU&XUUHQW $PSV  I&- &ROOHFWRU&XUUHQW $PSV  hFE v IC VBE(sat) v IC Single Pulse Test at Tamb=25°C 1.6 V% (- (Volts) 1.4 -55°C +25°C +100°C +175°C I& - Collector Current (Amps) 10 VCE=5V 1.2 1.0 0.8 0.6 0.4 0.2 0 0.001 0.01 0.1 1 I&- &ROOHFWRU&XUUHQW $PSV  VBE(on) v IC 10 20 1 0.1 0.01 1 D.C. 1s 100ms 10ms 1.0ms 0.1ms 10 100 1000 V&( - &ROOHFWRU9ROWDJH 9ROWV  Safe Operating Area www.msksemi.com FZT955-MS Semiconductor PACKAGE MECHANICAL DATA Symbol A A1 A2 b b1 c D E E1 e L θ Dimensions In Millimeters Min. Max. —— 1.800 0.020 0.100 1.500 1.700 0.660 0.840 2.900 3.100 0.230 0.350 6.300 6.700 6.700 7.300 3.300 3.700 2.300(BSC) 0.750 —— 0° 10° Dimensions In Inches Min. Max. —— 0.071 0.001 0.004 0.059 0.067 0.026 0.033 0.114 0.122 0.009 0.014 0.248 0.264 0.264 0.287 0.130 0.146 0.091(BSC) 0.030 —— 0° 10° REEL SPECIFICATION P/N FZT955-MS PKG SOT-223 QTY 1000 Compiance FZT955-MS Semiconductor Compiance Attention ■ Any and all MSKSEMI Semiconductor products described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability, such as life-support systems, aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. Consult with your MSKSEMI Semiconductor representative nearest you before using any MSKSEMI Semiconductor products described or contained herein in such applications. ■ MSKSEMI Semiconductor assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specificationsof any andall MSKSEMI Semiconductor products described orcontained herein. ■ Specifications of any and all MSKSEMI Semiconductor products described or contained herein stipulate the performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the performance, characteristics, and functions of the described products as mounted in the customer’s products or equipment. To verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test devices mounted in the customer’sproducts orequipment. ■ MSKSEMI Semiconductor. strives to supply high-quality high-reliability products. However, any and all semiconductor products fail with someprobability. It is possiblethat these probabilistic failures could give rise to accidents or events that could endanger human lives, that could give rise to smoke or fire, or that could cause damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not limited to protective circuits anderror prevention circuitsfor safedesign, redundant design, and structural design. ■ In the event that any or all MSKSEMI Semiconductor products(including technical data, services) described or contained herein are controlled under any of applicable local export control laws and regulations, such products must not be exported without obtaining the export license from theauthorities concerned in accordance with the above law. ■ No part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise, without the prior written permission of MSKSEMI Semiconductor. ■ Information (including circuit diagrams and circuit parameters) herein is for example only ; it is not guaranteed for volume production. MSKSEMI Semiconductor believes information herein is accurate and reliable, but no guarantees are made or implied regarding its use or any infringementsof intellectual property rights or other rightsof third parties. ■ Any and all information described or contained herein are subject to change without notice due to product/technology improvement, etc. Whendesigning equipment, referto the "Delivery Specification" for the MSKSEMI Semiconductor productthat you intend to use. www.msksemi.com
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